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Wafer Edge Grinding Machine

[MFR]DAIICHI SEIKI

[Model]WGM-200C

[Year]

SELLER :Tokyo Engineering Co., Ltd.

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ID:#5618

Wafer Edge Grinding Machine

[MFR]FUKOKU

[Model]CF/165

[Year]

AC100V/0.2kw 50/60Hz 3000/3600rpm Flap disc size: 165*22mm

SELLER :Tokyo Engineering Co., Ltd.

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ID:#5619

Chamfering Machine

[MFR]

[Model]

[Year]

SELLER :Tokyo Engineering Co., Ltd.

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ID:#5620

Chamfering Machine

[MFR]KABUTOYAMA

[Model]KSG-510YR

[Year]2005

1spindle M0.75￣M6 Iron: 0.2￣0.8 molding: 0.2￣1.2 brass: 0.2￣1.0 minφ25 x 20L maxφ500 x 150L

SELLER :Human Arc Machinery Co.Ltd

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ID:#7857

Chamfering Machine

[MFR]JAPAN AUTOMATIC MACHINE

[Model]

[Year]

SELLER :Shinmeiwa Kiko Co.,Ltd

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ID:#15996

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